| PART |
Description |
Maker |
| 3E26 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 3C11 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 4S60 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 3E55 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 3B7 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 3C90 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 3R1 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 4B3 |
Material specification
|
Ferroxcube International Holding B.V.
|
| POD-19X10.6-6P-SW |
BOBBIN MATERIAL: PHENOLIC PIN MATERIAL: CP WIRE UL REC. UL 94V-0
|
FERYSTER Inductive Components Manufacturer
|
| K4S641632H-UC60 K4S641632H-UC70 K4S641632H-UC75 K4 |
64Mb H-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) 64芯片与内存规格铅54 TSOP-II免费（符合RoHS
D-Subminiature Connector; Gender:Female; No. of Contacts:50; Contact Termination:IDC; D Sub Shell Size:DB50; Body Material:Steel; Contact Plating:Gold Over Nickel RoHS Compliant: Yes 64芯片与内存规格铅54 TSOP-II免费（符合RoHS
64Mb H-die SDRAM Specification 54 TSOP-II with Pb-Free 64芯片与内存规格铅54 TSOP-II免费
DELTA CONN 14POS PLUG W/O INSERT
DELTA CONN 14 POS PLUG BAIL LOCK
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
|
| OPB16450UART |
This document provides the specification
DS433 August 18, 2004 Product Specification
|
Xilinx, Inc.
|
| 52271-2279 |
PC Board Connector; No. of Contacts:22; Pitch Spacing:1mm; No. of Rows:1; Mounting Type:PCB SMT; Body Material:PA Polyamide (Nylon) 4/6; Contact Material:Phosphor Bronze; Gender:Receptacle; Series:52271 RoHS Compliant: Yes
|
MOLEX INC
|
